TI Interconnection burn–in sockets are designed with "flexibility of design" in mind. This allows easier modification for different package sizes. A platform design approach is utilized where a base socket can accommodate a variety of different package sizes. The adapter, which personalizes the socket for a specific customer’s packate, is designed as a separate part.
Platform benefits include:
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Fast and low cost method. Changing the adapter provides a fast, low cost method of supplying new sockets for each new package size without the expense and time of tooling an entire socket. |
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Maximize board capacity and through–put. The availability of different bases within a socket family allows the Interconnection team to work with our customers to select the smallest footprint, maximizing burn–in board capacity and oven through–put. |
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Proven contact technology.The socket uses the same proven, qualified contact technology—improving reliability and confidence in the performance of the socket. |
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