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Sensata Technologies also offers a small 26x19.50mm outline through–hole socket for smaller 0.50mm packages. This socket can accept packages up to 11x17mm and utilizes a dual pinch style contact, eliminating any witness marks on the bottom of the ball.
Above: (Left) Off–set contact used for BGA pitches of 0.8–1.27mm. (Middle) In–line contact used for BGA pitches 0.5–1.0mm. (Right) Dual pinch contact, Sensata internal SEM photograph showing minimal ball damage.
| Mechanical Characteristics |
Contact system |
Normally closed |
Package insertion force |
ZIF |
Contact force |
Typical: Approximately 15g/pin
Range: 10–20g/pin |
Durability |
Minimum: 10,000 cycles |
Temperature range |
-55°C to 150°C |
Contact point |
Side of solder ball |
Maximum IC offset |
During load: ±1.0mm in X or Y axis |
Actuation force |
Typical: 1.0kg |
| Electrical Characteristics |
Current rating |
1 amp per pin |
Insulation resistance |
1000 mohms at 500V DC |
Dielectric voltage |
Withstands 700V AC for 1 minute |
Contact resistance at 10mA |
Initial: 50 mohm maximum
After 10K cycles: 1 ohm maximum |
Inductance |
6nH at 50 MHz, approximately |
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