Accommodating package sizes from 15x15mm to 5x5mm, the TI Interconnection burn–in socket portfolio for 0.5mm pitch BGA packages is available in both compression mount and through–hole.
TI Interconnection 0.5mm pitch burn–in sockets employ a vertically actuated "compression" style contact that interfaces with individual solder balls. The contact-to-ball, interfaced at two locations per ball, gives minimum spherical deformation while providing a reliable electrical connection. The contact systems used accommodate both Pb and Pb–free balls.
Above: (Left) Buckling beam, used for BGA pitches 0.5mm and below. (Right) 0.5mm buckling beam, TI Internal SEM photograph showing consistent alignment of witness mark.
| Mechanical Characteristics |
Contact system |
Normally uncompressed |
Package insertion force |
ZIF |
Contact force |
Typical: Approximately 12g/pin
Range: 10–14g/pin |
Durability |
Minimum: 10,000 cycles |
Temperature range |
-55°C to 150°C |
Contact point |
Side of solder ball |
Maximum IC offset |
During load: ±1.0mm in X or Y axis |
Actuation force |
1.2kg to 5.0kg |
| Electrical Characteristics |
Current rating |
0.25 amp per pin |
Insulation resistance |
1000 Mohms at 500V DC |
Dielectric voltage |
Withstands 500V AC for 1 minute |
Contact resistance at 10mA |
Initial: 100 mohm maximum
After 10K cycles: 1 ohm maximum |
Inductance |
6nH at 50 MHz, approximately |
