Sensata | Products: Characteristics of the 0.8mm Pitch BGA

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Sensata > Products > Controls > Burn–In Sockets > BGA > CSP >

CSP BGA: 0.80mm Pitch Sockets

Mechanical Characteristics
Contact system	Normally closed
Package insertion force	ZIF
Contact force	Typical: Approximately 12g/pin Range: 10–15g/pin
Durability	Minimum: 10,000 cycles
Temperature range	-40°C to 150°C
Contact point	Side of solder ball
Maximum IC offset	During load: ±0.5mm in X or Y axis
Actuation force	Typical: 3.0kg (300–pin)
Thru–hole contact	Length: 2.0mm

Electrical Characteristics
Current rating	1 amp per pin
Insulation resistance	1000 mohms at 500V DC
Dielectric voltage	Withstands 700V AC for 1 minute
Contact resistance at 10mA	Initial: 50 mohm maximum initial After 10K cycles: 1 ohm maximum
Inductance	6nH at 50 MHz, approximately

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Product Availability
Maximum package sizes and socket dimensions

Package max: 27 x 27 mm
Outline max: 41 x 41 mm

Package max: 23 x 23 mm
Outline max: 36 x 36 mm

Package max: 19 x 19 mm
Outline max: 32 x 32 mm

Package max: 13 x 13 mm
Outline max: 25 x 25 mm

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