New Product Supports Growth of Wireless, Digital Device Market
MANSFIELD, MA (MAY 4, 2000) | Texas Instruments Interconnection business today announced the availability of its high
volume burn–in test solution for memory and logic IC’s that use the new ultrafine 0.5mm–pitch chipscale package. TI’s new socket will
support the growing market of wireless devices, such as cell phones and personal digital assistants, which increasingly rely on fine–pitch
semiconductors to achieve high performance in a small package.
With the new socket, semiconductor designers, manufacturers, and product developers can take advantage of next generation chipsets.
As wireless and digital devices shrink in size, the industry is looking to take advantage of the smaller 0.5mm–pitch semiconductor and
create chipsets that integrate multiple components, such as memory, logic, and DSP semiconductors. Manufacturers will use the new socket
to burn–in and test various 0.5mm–pitch components that will eventually ship in system-on-chip, embedded memory (SRAM, Flash, and
DRAM), multichip packaging, and stacked chipsets.
TI’s new socket is specifically designed to overcome the barriers of testing the ultrafine 0.5mm CSP. The new socket features a
clamshell design for easy insertion and compression style micro–spring contacts to provide robust yet sensitive contact with the
delicate solder balls. The new micro–springs touch the side of the solder ball, instead of approaching the ball from the bottom like
pogo–stick or y–contact test sockets, ensuring a reliable electrical contact without causing damaging probe marks. The result is better
solder ball integrity, which is vital to the ball’s subsequent assembly to the printed wire board.
To ensure a robust connection during testing, the new socket is held onto the burn–in board with screws that compress the contact
elements and provide a semi–permanent interconnect. The new 0.5mm socket adds to TI’s solutions for the full range of package
designs, which include CSP, BGA, KGD, QFP, SOP, SOJ, TSOP, PGA, and LGA.
"Burn–in is a critical function, especially for newer, ultra fine pitch CSPs," said Edmund F. Craig, III, sales and marketing
manager for Texas Instruments Interconnection business. "Developing a test solution to support 0.5mm pitch is important as
the market gravitates towards denser arrays and the smallest possible IC packaging."
The sockets for 0.5mm packages from TI are currently enabling high volume production of DRAM, SRAM, logic, and flash devices.
Since TI’s sockets utilize existing test equipment and standard processing, such as burn–in boards and ovens, market adoption
should be strong.
ABOUT TEXAS INSTRUMENTS
Texas Instruments, Inc., is a global semiconductor company and the world’s leading designer and supplier of digital
signal processing solutions, the engines driving the digitization of electronics. Headquartered in Dallas, Texas, the company’s
major businesses also include Calculators, Productivity Products, Sensors & Controls, and Digital Light Products
technologies. The company has manufacturing and/or sales operations in more than 25 countries.
TI is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web
at www.ti.com.
ABOUT TI INTERCONNECTION
Located in Mansfield, Mass., the Interconnection Business is part of TI’s Materials & Controls group.
Note to Editors: Rambus and RDRAM are registered trademarks of Rambus Inc. Direct Rambus and Direct RDRAM are trademarks of Rambus Inc.
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